Towson, USA
May 27-29, 2026
Venue: Towson University
Okayama, Japan
August 22-24, 2026
Venue: Okayama University
Las Vegas, USA
May 26-28, 2027
Venue: University of Nevada - Las Vegas
*IEEE & ACM co-sponsorship in the process of approval
Hohhot, Inner Mongolia, P.R., China
July 15-17, 2027
Venue: Inner Mongolia University of Technology (IMUT)
*IEEE & ACM co-sponsorship in the process of approval.
Beijing, China
August 25-27, 2027
Venue: Beijing University of Posts and Telecommunicationss
Kyoto, Japan
September 8-10, 2027
Venue: Kyoto Institute of Technology
