Towson, USA
May 27-29, 2026
Venue: Towson University
Okayama, Japan
August 22-24, 2026
Venue: Okayama University
Las Vegas, USA
May 26-28, 2027
Venue: University of Nevada - Las Vegas
*IEEE & ACM co-sponsorship in the process of approval
Beijing, China
August 25-27, 2027
Venue: Beijing University of Posts and Telecommunicationss
Kyoto, Japan
September 8-10, 2027
Venue: Kyoto Institute of Technology
*IEEE & ACM co-sponsorship in the process of approval.
